Billion Sea Enterprise Ltd. - DOUBLE SIDED PROCESS
STAGE 1 Qutotation , Drill data, etc.
STAGE 2 Review all information
STAGE 3 Sample Approval
STAGE 4 Punching Die, E.Test Fixture built
STAGE 5 Laminates are selected :FR-4. CEM-3
STAGE 6 Panels are cut to suitable sizes
STAGE 7 All panels put in oven for 4 hrs at 130 oC
STAGE 8 CNC Drilling
STAGE 9 Plated Thru Hole
STAGE 10 Image Transfer
STAGE 11 Copper Pattern plating
STAGE12 Gold or Tin Lead Plating
STAGE 13 Etching
STAGE 14 Tin/ Lead Stripping
STAGE 15 E.Test & 100 % QC Inspection
STAGE 16 Soldermask & Component Marking
STAGE 18 Outline profile
STAGE 19 Final Electrical Test
STAGE 20 Entek ( if required )
STAGE 21 Final QC
STAGE 22 Packing & Shipping
The Flow Chart of PCB process.
The Multilayers of PCB process.
STAGE 1
Gerber File for circuit layout ,Drill Data ,Routing Data , Mechanical Drawing to make punching die.
STAGE 2
Design Checking , Calculation for the best uilization rate of each panels. Films, Drill tape, are produced at this stage .
STAGE 3
The sample approved by customers , then go on mass production stage .
STAGE 4
For mass production , the Punching Die and Electrical Test Fixture will be produced .
STAGE 5
FR-4 & CEM-3 are most common use for double side production, the sizes are:
Panels are cut to suitable sizes for mass production . Then undergo Corner , Edge .
STAGE 7
All panels are then put into oven for eliminate the stress and remove shrinkage problem .
STAGE 8
After CNC drilling, all panels are checked : Hole Size ; Hole Position ; Hole Quantity .
use the Mylay hole position sheets, Pin Guage, CNC drill check respectivetly.
STAGE 9
A process called PTH ( Plated Thrpugh Hole ) . It is a process where copper patricles deposited
onto the hole wall of each holes.To connect the upper & lower side of PCB .
STAGE 10
Before go futher process, the boards clean first . Then transfer the circuit image onto upper & lower
side of boards . Two methods use nowadays : Silk Screen, Dry Film .
STAGE 11
Additive Process , where copper deposited onto circuit .
STAGE 12
For Gold plating : Nickel plating first then gold plating.
For HAL ,Entek : Tin Lead plating first then HAL or Entek plating.
STAGE 13
Removed all unwanted copper .
STAGE 14
For the process of HAL or Entek only .
STAGE 15
Tested for open / short with Electrical Test Fixture .
STAGE 16
Soldermask : An insulating coating applied on both sides of PCB .
Component Marking : White colour die to mark vendor code, UL number, component nos.
STAGE 17
Tin Lead are deposited onto PCB via HAL process .
STAGE 18
The outline by routing or die . V-cut , chamfering also in this stage .
STAGE 19
Entek process where chemical applied onto surface to prevent oxidation.
STAGE21
Final Inspection
STAGE 22
Packing & Shipment
